Granted Patent
Utility
US 5,923,091 · App. 08/917,342
Bonded semiconductor integrated circuit device
Inventor:
Takao Nagai
Patented Case
View Patent ↗
Granted: Jul 13, 1999
Filed: Aug 26, 1997
Inventor
Takao Nagai
Assignee (at issue)
MITSUBISHI ELECTRIC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.