Granted Patent
Utility
US 5,923,178 · App. 08/837,399
Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers
Inventors:
H. Dan Higgins, Martin Martinez, R. Dennis Bates
Patented Case
View Patent ↗
Granted: Jul 13, 1999
Filed: Apr 17, 1997
Inventors
H. Dan Higgins
Martin Martinez
R. Dennis Bates
Assignee (at issue)
Cerprobe Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.