Granted Patent
Utility
US 5,925,577 · App. 08/943,891
Method for forming via contact hole in a semiconductor device
Inventor:
Ramiro Solis
Patented Case
View Patent ↗
Granted: Jul 20, 1999
Filed: Oct 3, 1997
Inventor
Ramiro Solis
Assignee (at issue)
VLSI Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.