Granted Patent
Utility
US 5,930,604 · App. 09/017,435
Encapsulation method for fine-pitch chip-on-board
Inventors:
Jay F. Leonard, Yanshu Chen
Patented Case
View Patent ↗
Granted: Jul 27, 1999
Filed: Feb 2, 1998
Inventors
Jay F. Leonard
Yanshu Chen
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.