Granted Patent
Utility
US 5,930,675 · App. 08/632,908
Process of forming inter-level connection without increase of contact resistance
Inventor:
Hiromitsu Hada
Patented Case
View Patent ↗
Granted: Jul 27, 1999
Filed: Apr 16, 1996
Inventor
Hiromitsu Hada
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.