Granted Patent
Utility
US 5,932,289 · App. 08/831,600
Method for filling substrate recesses using pressure and heat treatment
Inventors:
Christopher Dobson, Arthur John McGeown
Patented Case
View Patent ↗
Granted: Aug 3, 1999
Filed: Apr 10, 1997
Inventors
Christopher Dobson
Arthur John McGeown
Assignee (at issue)
Trikon Technologies Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.