Granted Patent
Utility
US 5,939,334 · App. 08/861,808
System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides
Inventors:
Tue Nguyen, Lawrence J. Charneski, David R. Evans, Sheng Teng Hsu
Patented Case
View Patent ↗
Granted: Aug 17, 1999
Filed: May 22, 1997
Inventors
Tue Nguyen
Lawrence J. Charneski
David R. Evans
Sheng Teng Hsu
Assignees (at issue)
Sharp Laboratories of America, Inc.
SHARP KABUSHIKI KAISHA
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.