Granted Patent
Utility
US 5,945,709 · App. 08/907,276
Integrated circuit die having thick bus to reduce distributed resistance
Inventors:
Richard K. Williams, Mohammad Kasem
Patented Case
View Patent ↗
Granted: Aug 31, 1999
Filed: Aug 6, 1997
Inventors
Richard K. Williams
Mohammad Kasem
Assignee (at issue)
SILICONIX INCORPORATED
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.