Granted Patent
Utility
US 5,951,813 · App. 08/643,036
Top of die chip-on-board encapsulation
Inventor:
Robert W. Warren
Patented Case
View Patent ↗
Granted: Sep 14, 1999
Filed: May 2, 1996
Inventor
Robert W. Warren
Assignee (at issue)
Raytheon Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.