Granted Patent
Utility
US 5,952,646 · App. 08/968,130
Low temperature bump-bonding semiconductor imaging device
Inventors:
Konstantinos Spartiotis, Jaakko Salonen
Patented Case
View Patent ↗
Granted: Sep 14, 1999
Filed: Nov 12, 1997
Inventors
Konstantinos Spartiotis
Jaakko Salonen
Assignee (at issue)
Simage Oy
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.