Granted Patent
Utility
US 5,953,211 · App. 09/076,305
Apparatus including heat sink structure for removing heat from a printed circuit board
Inventors:
Daniel N. Donahoe, Henry E. Mecredy, III
Patented Case
View Patent ↗
Granted: Sep 14, 1999
Filed: May 11, 1998
Inventors
Daniel N. Donahoe
Henry E. Mecredy, III
Assignee (at issue)
Compaq Computer Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.