Granted Patent
Utility
US 5,953,589 · App. 08/915,077
Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same
Inventors:
Il Kwon Shim, Young Wook Heo, Robert Francis Darreaux
Patented Case
View Patent ↗
Granted: Sep 14, 1999
Filed: Aug 20, 1997
Inventors
Il Kwon Shim
Young Wook Heo
Robert Francis Darreaux
Assignees (at issue)
Anam Semiconductor
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.