Granted Patent
Utility
US 5,953,814 · App. 09/032,148
Process for producing flip chip circuit board assembly exhibiting enhanced reliability
Inventors:
Wayne Anthony Sozansky, Michael D. Gibson, Susan Acheson Mack, Michael Patrick Meehan, Darrel E. Peugh, James M. Rosson, Robin L. Sellers, Michael R. Witty
Patented Case
View Patent ↗
Granted: Sep 21, 1999
Filed: Feb 27, 1998
Inventors
Wayne Anthony Sozansky
Michael D. Gibson
Susan Acheson Mack
Michael Patrick Meehan
Darrel E. Peugh
James M. Rosson
Robin L. Sellers
Michael R. Witty
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.