Granted Patent
Utility
US 5,957,764 · App. 08/964,930
Modular wafer polishing apparatus and method
Inventors:
H. Alexander Anderson, Linh X. Can, Tsungnan Cheng, Garry K. Kwong, Albert Hu, David Z. Chen, Shu-Wong Samuel Lee
Patented Case
View Patent ↗
Granted: Sep 28, 1999
Filed: Nov 5, 1997
Inventors
H. Alexander Anderson
Linh X. Can
Tsungnan Cheng
Garry K. Kwong
Albert Hu
David Z. Chen
Shu-Wong Samuel Lee
Assignee (at issue)
Aplex, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.