Granted Patent
Utility
US 5,959,362 · App. 08/874,277
Device mounting a semiconductor element on a wiring substrate including an adhesive material having first and second adhesive components with different cure characteristics
Inventor:
Rieka Yoshino
Patented Case
View Patent ↗
Granted: Sep 28, 1999
Filed: Jun 13, 1997
Inventor
Rieka Yoshino
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.