Granted Patent
Utility
US 5,960,314 · App. 09/156,231
Semiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally conductive node and an elevationally outer electrically conductive node
Inventors:
Howard E. Rhodes, Timothy P. O'Brien, Rod C. Langley
Patented Case
View Patent ↗
Granted: Sep 28, 1999
Filed: Sep 18, 1998
Inventors
Howard E. Rhodes
Timothy P. O'Brien
Rod C. Langley
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.