Granted Patent
Utility
US 5,960,539 · App. 09/021,744
Method of making high density integrated circuit module
Inventor:
Carmen D. Burns
Patented Case
View Patent ↗
Granted: Oct 5, 1999
Filed: Feb 11, 1998
Inventor
Carmen D. Burns
Assignee (at issue)
Staktek Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.