Granted Patent
Utility
US 5,962,926 · App. 08/940,605
Semiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placement
Inventors:
Victor Manuel Torres, Ashok Srikantappa, Laxminarayan Sharma
Patented Case
View Patent ↗
Granted: Oct 5, 1999
Filed: Sep 30, 1997
Inventors
Victor Manuel Torres
Ashok Srikantappa
Laxminarayan Sharma
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.