Granted Patent
Utility
US 5,963,315 · App. 08/912,726
Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection
Inventors:
William M. Hiatt, Barbara Vasquez, Karl Mautz
Patented Case
View Patent ↗
Granted: Oct 5, 1999
Filed: Aug 18, 1997
Inventors
William M. Hiatt
Barbara Vasquez
Karl Mautz
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.