Granted Patent
Utility
US 5,963,427 · App. 08/988,788
Multi-chip module with flexible circuit board
Inventor:
Vernon P. Bollesen
Patented Case
View Patent ↗
Granted: Oct 5, 1999
Filed: Dec 11, 1997
Inventor
Vernon P. Bollesen
Assignee (at issue)
Sun Microsystems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.