Granted Patent
Utility
US 5,964,646 · App. 08/971,642
Grinding process and apparatus for planarizing sawed wafers
Inventors:
Salman Kassir, Thomas A. Walsh
Patented Case
View Patent ↗
Granted: Oct 12, 1999
Filed: Nov 17, 1997
Inventors
Salman Kassir
Thomas A. Walsh
Assignee (at issue)
Strasbaugh
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.