IP Library Granted Patent US 5,965,310
Granted Patent Utility
US 5,965,310 · App. 09/041,656

Process of patterning photo resist layer extending over step of underlying layer without deformation of pattern

Inventor: Mitsuharu Yamana
Patented Case View Patent ↗
Granted: Oct 12, 1999 Filed: Mar 13, 1998
Inventor
Mitsuharu Yamana
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 5,965,310
App. No.
09/041,656
Filed
1998-03-13
Granted
1999-10-12
Kind
A