Granted Patent
Utility
US 5,966,593 · App. 08/748,112
Method of forming a wafer level contact sheet having a permanent z-axis material
Inventors:
John J. Budnaitis, Jimmy Leong
Patented Case
View Patent ↗
Granted: Oct 12, 1999
Filed: Nov 8, 1996
Inventors
John J. Budnaitis
Jimmy Leong
Assignee (at issue)
W. L. Gore & Associates, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.