Granted Patent
Utility
US 5,968,849 · App. 08/512,050
Method for pre-shaping a semiconductor substrate for polishing and structure
Inventors:
Fernando A. Bello, James Brian Hall, Earl W. O'Neal, James S. Parsons, Cindy Welt, George Bailey
Patented Case
View Patent ↗
Granted: Oct 19, 1999
Filed: Aug 7, 1995
Inventors
Fernando A. Bello
James Brian Hall
Earl W. O'Neal
James S. Parsons
Cindy Welt
George Bailey
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.