Granted Patent
Utility
US 5,972,162 · App. 09/003,346
Wafer polishing with improved end point detection
Inventor:
Joseph V. Cesna
Patented Case
View Patent ↗
Granted: Oct 26, 1999
Filed: Jan 6, 1998
Inventor
Joseph V. Cesna
Assignee (at issue)
SPEEDFAM CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.