IP Library › Granted Patent US 5,975,913
Granted Patent Utility
US 5,975,913 · App. 09/050,889

Multilayer interconnection board and connection pin

Inventors: Shigehito Wada, Hisashi Saitou, Kazutoshi Morishima
Patented Case View Patent ↗
Granted: Nov 2, 1999 Filed: Mar 31, 1998
Inventors
Shigehito Wada
Hisashi Saitou
Kazutoshi Morishima
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.

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Quick Facts
Patent No.
US 5,975,913
App. No.
09/050,889
Filed
1998-03-31
Granted
1999-11-02
Kind
A