Granted Patent
Utility
US 5,976,306 · App. 09/025,564
Method and apparatus for removing die from an expanded wafer and conveying die to a pickup location
Inventors:
Peter Davis, Dean Tarrant
Patented Case
View Patent ↗
Granted: Nov 2, 1999
Filed: Feb 18, 1998
Inventors
Peter Davis
Dean Tarrant
Assignee (at issue)
Hover-Davis, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.