Granted Patent
Utility
US 5,977,613 · App. 08/811,606
Electronic component, method for making the same, and lead frame and mold assembly for use therein
Inventors:
Hirofumi Takata, Tadashi Tanida
Patented Case
View Patent ↗
Granted: Nov 2, 1999
Filed: Mar 4, 1997
Inventors
Hirofumi Takata
Tadashi Tanida
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.