Granted Patent
Utility
US 5,977,632 · App. 09/017,562
Flip chip bump structure and method of making
Inventor:
Stanley Craig Beddingfield
Patented Case
View Patent ↗
Granted: Nov 2, 1999
Filed: Feb 2, 1998
Inventor
Stanley Craig Beddingfield
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.