Granted Patent
Utility
US 5,979,739 · App. 08/949,337
Semiconductor die bonding apparatus having multiple bonding system
Inventors:
Ho Jin, Jae Ky Roh, Sung-Bok Hong, Hee-Kook Choi
Patented Case
View Patent ↗
Granted: Nov 9, 1999
Filed: Oct 14, 1997
Inventors
Ho Jin
Jae Ky Roh
Sung-Bok Hong
Hee-Kook Choi
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.