Granted Patent
Utility
US 5,981,037 · App. 09/016,857
Patterned bonding of encapsulation material to an insulation assembly
Inventors:
Bharat Patel, Steven G. Schmitt, Michael T. Heffelfinger, Rebecca L. Thomas-Dutiel, Weigang Qi
Patented Case
View Patent ↗
Granted: Nov 9, 1999
Filed: Jan 30, 1998
Inventors
Bharat Patel
Steven G. Schmitt
Michael T. Heffelfinger
Rebecca L. Thomas-Dutiel
Weigang Qi
Assignee (at issue)
Owens-Corning Fiberglas Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.