Granted Patent
Utility
US 5,985,693 · App. 08/850,749
High density three-dimensional IC interconnection
Inventor:
Glenn J. Leedy
Patented Case
View Patent ↗
Granted: Nov 16, 1999
Filed: May 2, 1997
Inventor
Glenn J. Leedy
Assignee (at issue)
Elm Technology Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.