Granted Patent
Utility
US 5,986,217 · App. 08/956,166
Printed circuit board for mitigating thermally-induced mechanical damage of solder joints connecting electronic components
Inventor:
Michael J. Strum
Patented Case
View Patent ↗
Granted: Nov 16, 1999
Filed: Oct 22, 1997
Inventor
Michael J. Strum
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.