Granted Patent
Utility
US 5,986,343 · App. 09/072,369
Bond pad design for integrated circuits
Inventors:
Sailesh Chittipeddi, Vivian W. Ryan
Patented Case
View Patent ↗
Granted: Nov 16, 1999
Filed: May 4, 1998
Inventors
Sailesh Chittipeddi
Vivian W. Ryan
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.