IP Library Granted Patent US 5,989,653
Granted Patent Utility
US 5,989,653 · App. 08/986,379

Process for metallization of a substrate by irradiative curing of a catalyst applied thereto

Inventors: Ken S. Chen, William P. Morgan, John L. Zich
Patented Case View Patent ↗
Granted: Nov 23, 1999 Filed: Dec 8, 1997
Inventors
Ken S. Chen
William P. Morgan
John L. Zich
Assignee (at issue)
Sandia Corporation

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Quick Facts
Patent No.
US 5,989,653
App. No.
08/986,379
Filed
1997-12-08
Granted
1999-11-23
Kind
A