Granted Patent
Utility
US 5,993,293 · App. 09/098,774
Method and apparatus for improved semiconductor wafer polishing
Inventors:
Joseph V. Cesna, Inki Kim
Patented Case
View Patent ↗
Granted: Nov 30, 1999
Filed: Jun 17, 1998
Inventors
Joseph V. Cesna
Inki Kim
Assignee (at issue)
Speedram Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.