Granted Patent
Utility
US 5,994,142 · App. 08/915,273
Method for collecting a metallic contaminants from a wafer
Inventors:
Shinya Yamasaki, Hidemitsu Aoki
Patented Case
View Patent ↗
Granted: Nov 30, 1999
Filed: Aug 20, 1997
Inventors
Shinya Yamasaki
Hidemitsu Aoki
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.