Granted Patent
Utility
US 5,997,708 · App. 08/846,607
Multilayer integrated assembly having specialized intermediary substrate
Inventor:
Stephen R. Craig
Patented Case
View Patent ↗
Granted: Dec 7, 1999
Filed: Apr 30, 1997
Inventor
Stephen R. Craig
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.