IP Library Granted Patent US 6,001,733
Granted Patent Utility
US 6,001,733 · App. 09/164,856

Method of forming a dual damascene with dummy metal lines

Inventors: Yimin Huang, Ming-Sheng Yang, Tri-Rung Yew
Patented Case View Patent ↗
Granted: Dec 14, 1999 Filed: Oct 1, 1998
Inventors
Yimin Huang
Ming-Sheng Yang
Tri-Rung Yew
Assignee (at issue)
WINBOND ELECTRONICS CORP.

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Quick Facts
Patent No.
US 6,001,733
App. No.
09/164,856
Filed
1998-10-01
Granted
1999-12-14
Kind
A