IP Library › Granted Patent US 6,002,170
Granted Patent Utility
US 6,002,170 · App. 08/687,929

Chip carrier with embedded leads and chip package using same

Inventors: Sun-Dong Kim, Byong Su Seol
Patented Case View Patent ↗
Granted: Dec 14, 1999 Filed: Jul 29, 1996
Inventors
Sun-Dong Kim
Byong Su Seol
Assignee (at issue)
LG Semicon Co., Ltd.

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Quick Facts
Patent No.
US 6,002,170
App. No.
08/687,929
Filed
1996-07-29
Granted
1999-12-14
Kind
A