Granted Patent
Utility
US 6,002,176 · App. 09/135,376
Differential copper deposition on integrated circuit surfaces
Inventors:
Tue Nguyen, Lawrence J. Charneski, Sheng Teng Hsu
Patented Case
View Patent ↗
Granted: Dec 14, 1999
Filed: Aug 17, 1998
Inventors
Tue Nguyen
Lawrence J. Charneski
Sheng Teng Hsu
Assignees (at issue)
Sharp Laboratories of America, Inc.
SHARP KABUSHIKI KAISHA
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.