Granted Patent
Utility
US 6,005,293 · App. 08/903,434
Wire-bonded semiconductor device
Inventor:
Nobuyuki Mori
Patented Case
View Patent ↗
Granted: Dec 21, 1999
Filed: Jul 30, 1997
Inventor
Nobuyuki Mori
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.