Granted Patent
Utility
US 6,005,965 · App. 09/056,234
Inspection apparatus for semiconductor packages
Inventors:
Yukihiro Tsuda, Takashi Kurihara, Takahiro Ueda, Tomikazu Tanuki, Yasuyoshi Suzuki
Patented Case
View Patent ↗
Granted: Dec 21, 1999
Filed: Apr 7, 1998
Inventors
Yukihiro Tsuda
Takashi Kurihara
Takahiro Ueda
Tomikazu Tanuki
Yasuyoshi Suzuki
Assignee (at issue)
KOMATSU LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.