Granted Patent
Utility
US 6,006,979 · App. 08/961,236
Method of bonding a diamond substrate to at least one metal substrate
Inventors:
Alain Petitbon, Eric Ranchy
Patented Case
View Patent ↗
Granted: Dec 28, 1999
Filed: Oct 30, 1997
Inventors
Alain Petitbon
Eric Ranchy
Assignee (at issue)
ALCATEL
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.