Granted Patent
Utility
US 6,008,070 · App. 09/082,745
Wafer level fabrication and assembly of chip scale packages
Inventor:
Warren M. Farnworth
Patented Case
View Patent ↗
Granted: Dec 28, 1999
Filed: May 21, 1998
Inventor
Warren M. Farnworth
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.