Granted Patent
Utility
US 6,008,113 · App. 09/081,696
Process for wafer bonding in a vacuum
Inventors:
M. Salleh Ismail, Jeffrey Wong
Patented Case
View Patent ↗
Granted: Dec 28, 1999
Filed: May 19, 1998
Inventors
M. Salleh Ismail
Jeffrey Wong
Assignee (at issue)
KAVLICO CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.