Granted Patent
Utility
US 6,008,121 · App. 08/618,161
Etching high aspect contact holes in solid state devices
Inventors:
Chi-Hua Yang, Virinder Grewal, Volker B. Laux
Patented Case
View Patent ↗
Granted: Dec 28, 1999
Filed: Mar 19, 1996
Inventors
Chi-Hua Yang
Virinder Grewal
Volker B. Laux
Assignees (at issue)
Siemens Aktiengesellschaft
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.