Granted Patent
Utility
US 6,008,532 · App. 08/956,682
Integrated circuit package having bond fingers with alternate bonding areas
Inventor:
Karla Y. Carichner
Patented Case
View Patent ↗
Granted: Dec 28, 1999
Filed: Oct 23, 1997
Inventor
Karla Y. Carichner
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.