Granted Patent
Utility
US 6,008,536 · App. 08/880,784
Grid array device package including advanced heat transfer mechanisms
Inventor:
Atila Mertol
Patented Case
View Patent ↗
Granted: Dec 28, 1999
Filed: Jun 23, 1997
Inventor
Atila Mertol
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.