Granted Patent
Utility
US 6,011,302 · App. 09/082,480
Semiconductor device with reduced amount of sealing resin
Inventor:
Akira Nakahira
Patented Case
View Patent ↗
Granted: Jan 4, 2000
Filed: May 21, 1998
Inventor
Akira Nakahira
Assignee (at issue)
FUJI ELECTRIC CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.